In a bid to cater to the increasing demand for next-generation semiconductor chips, researchers have managed to achieve a significant milestone by laser-drilling tiny circuit board holes measuring a mere 3 micrometers in diameter. Yohei Kobayashi, an applied physics professor from the University of Tokyo's Institute of Solid State Physics, highlighted the significance of this technology advancement, emphasizing its potential to process circuit boards more flexibly and cost-effectively to accommodate the shrinking sizes of semiconductor chips.
The collaborative effort involved researchers from the University of Tokyo, Ajinomoto Fine-Techno Co., Mitsubishi Electric Corp., and Spectronix Corp., aiming to address the challenge posed by the need for high-density semiconductor chips in advanced technologies like generative artificial intelligence. Traditionally, the creation of micro via holes on circuit boards with a diameter of 5 micrometers or smaller was a bottleneck due to the standard 40-micrometer holes taking up excessive space on the boards, prompting the development of micro laser drilling capabilities.
The innovative approach taken by the team included the application of layers of insulator on a sheet of copper-covered glass, followed by the utilization of a fully-automated AI processing simulation that leverages a high-powered laser with an extremely short wavelength. This method not only revolutionizes the fabrication process of circuit boards but also holds the promise of enhancing the overall speed and design flexibility in creating semiconductor chips. Kobayashi expressed optimism that this achievement would significantly contribute to propelling the semiconductor industry towards the next generation of chip technology, marking a crucial milestone in the chip-making process.