A Breakthrough in Micro Laser Drilling for Next-Generation Semiconductor Chips
A team of researchers has achieved a significant breakthrough in the field of micro laser drilling, successfully creating the world's smallest circuit board holes, measuring a mere 3 micrometers in diameter. This advancement holds immense potential for the development of next-generation semiconductor chips, which require increasingly smaller and more efficient components.
The research team, comprised of experts from the University of Tokyo, Ajinomoto Fine-Techno Co., Mitsubishi Electric Corp., and Spectronix Corp., recognized the growing demand for high-density semiconductor chips used in generative artificial intelligence and other high-performance technologies. These chips necessitate the creation of micro via holes on circuit boards with a diameter of 5 micrometers or smaller. However, the standard 40-micrometer holes were simply too large for these miniaturized chips.
To address this challenge, the team developed a novel micro laser drilling method. This process involves layering an insulator on a sheet of copper-covered glass. Then, a fully-automated AI processing simulation, developed by the University of Tokyo researchers, guides a high-powered laser with an extremely short wavelength to drill the minuscule holes.
This groundbreaking achievement is expected to significantly enhance the speed and design flexibility of the chip-making process. It is also anticipated to contribute to the introduction of the next-generation semiconductor chip, paving the way for even more powerful and efficient technologies.
"Our achievement this time marks an important milestone for the subsequent process of finishing semiconductor chips," stated Yohei Kobayashi, an applied physics professor at the University of Tokyo's Institute for Solid State Physics. This breakthrough represents a significant step forward in the miniaturization of electronic components, opening doors to a future of even more advanced and sophisticated technologies.