Laser-Drilled Micro-Holes for Next-Gen Semiconductor Chips
Researchers have achieved a significant breakthrough in the field of semiconductor chip manufacturing by successfully laser-drilling the world's tiniest circuit board holes, measuring a mere 3 micrometers in diameter. This remarkable feat opens doors for more flexible and cost-effective processing of circuit boards, catering to the ever-shrinking size of semiconductor chips.
The research team, comprising experts from the University of Tokyo, Ajinomoto Fine-Techno Co., Mitsubishi Electric Corp., and Spectronix Corp., addressed the growing demand for high-density semiconductor chips used in generative artificial intelligence and other high-performance technologies. These chips require micro via holes on circuit boards with a diameter of 5 micrometers or smaller. However, the standard 40-micrometer holes were simply too large, taking up valuable space.
To overcome this challenge, the team developed a novel micro laser drilling method. They layered an insulator on a sheet of copper-covered glass and then employed a fully-automated AI processing simulation, developed by the University of Tokyo researchers, to guide a high-powered laser with an extremely short wavelength. This precise technique enabled the creation of the incredibly small 3-micrometer holes.
This breakthrough is expected to significantly enhance the speed and design flexibility of the chip-making process. It is also anticipated to contribute to the introduction of the next generation of semiconductor chips, paving the way for even more powerful and efficient technologies.
"Our achievement this time marks an important milestone for the subsequent process of finishing semiconductor chips," stated Yohei Kobayashi, an applied physics professor at the University of Tokyo's Institute for Solid State Physics. This advancement holds immense promise for the future of electronics and computing.