Siemens Software automates design process for testing chip

Siemens Digital Industries Software, a unit of Siemens AG, has launched a new software called Tessent Multi-die that automates a design process for testing chips made with advanced packaging.

As the industry struggles to make features on these tiles smaller and smaller to cram more computing power into them, companies like Intel are starting to stack several of them, sometimes mixing and matching different technologies to improve performance.

Siemens head of Tessent business Ankur Gupta said until now Siemens had to work with customers on a case-by-case basis to test these chips after they are made.

A port to test them has to be designed into the chip before they are made. Testing is a key part of the chip-making process.

Gupta told Reuters that the solution is being made available for everyone to use because we are taking all of those learnings and automating it.

He said that making the testing process easier for chips with advanced packaging, also referred to as 2.5 and 3 dimensional packaging, will give the new technology a boost.