Laser-Drilled Holes Revolutionize Circuit Board Technology
A team of researchers has achieved a groundbreaking feat in the world of circuit board technology by successfully laser-drilling the world's tiniest holes, measuring a mere 3 micrometers in diameter. This breakthrough, achieved at the University of Tokyo's Institute for Solid State Physics, has the potential to revolutionize the way next-generation semiconductor chips are manufactured.
The demand for smaller and more powerful semiconductor chips is constantly increasing, particularly for applications like generative artificial intelligence and other high-performance technologies. These chips require micro via holes on circuit boards with a diameter of 5 micrometers or smaller. However, the standard 40-micrometer holes used in current technology take up too much space, limiting the miniaturization of these chips.
To address this challenge, the research team developed a novel laser drilling method that involves placing layers of an insulator on a sheet of copper-covered glass. They then utilize a high-powered laser with an extremely short wavelength, guided by a fully-automated AI processing simulation developed by the University of Tokyo researchers. This process allows for the creation of incredibly precise and small holes, significantly reducing the space occupied by the micro via holes.
The team's findings are expected to significantly improve the speed and design flexibility of the chip-making process. This advancement is anticipated to play a crucial role in the introduction of the next-generation semiconductor chip, paving the way for even smaller and more powerful devices.
"Our achievement this time marks an important milestone for the subsequent process of finishing semiconductor chips," stated Yohei Kobayashi, an applied physics professor at the University of Tokyo's Institute for Solid State Physics. This breakthrough holds immense promise for the future of electronics, enabling the development of more efficient and powerful technologies.